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Plasma etching of silicon carbide trenches with high aspect ratio and rounded corners

Xiaoyu Tan, Guoming Lin, Ankuan Ji, Yuanwei Lin

2024Materials Science in Semiconductor Processing12 citationsDOI

Topics & Concepts

Materials scienceSilicon carbideEtching (microfabrication)Aspect ratio (aeronautics)Plasma etchingCarbideSiliconComposite materialMetallurgyLayer (electronics)Silicon Carbide Semiconductor TechnologiesDiamond and Carbon-based Materials ResearchCopper Interconnects and Reliability
Plasma etching of silicon carbide trenches with high aspect ratio and rounded corners | Litcius