Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper
Xin Li, Yanjun Zhou, Yahui Liu, Shaolin Li, Kexing Song, Cunli Feng, Baoan Wu, Pengfei Zhang, Hanjiang Wu, J. Gu, Siyu He, Yan Gao
Topics & Concepts
Materials scienceMicrostructureCopperUltimate tensile strengthSingle crystalCrystal twinningElectrical resistivity and conductivityComposite materialDislocationMetallurgyConductivityCrystal (programming language)Annealing (glass)CrystallographyProgramming languageChemistryElectrical engineeringComputer sciencePhysical chemistryEngineeringAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesAdvanced Welding Techniques Analysis