Double layer interfacial structure of Cr3C2–Cr7C3 in copper/diamond composites for thermal management applications
Wei Chen, Fengyi Wang, Lining Fan, Hui Zheng, Xiaoxiao Guo, Zheng Peng, Liang Zheng, Yang Zhang, Yang Zhang
Topics & Concepts
CopperMaterials scienceThermalComposite materialDiamondLayer (electronics)MetallurgyPhysicsThermodynamicsAdvanced materials and compositesAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesis