Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
Zhihu Wu, Wei Xiao, Hongyan He, Wei Wang, Bai Song
Topics & Concepts
MicrochannelHeat fluxMaterials scienceMicrofluidicsMiniaturizationHeat sinkElectronicsMicroelectromechanical systemsWater coolingElectronics coolingLayer (electronics)DissipationPower electronicsMechanicsOptoelectronicsActive coolingPower (physics)Substrate (aquarium)Manifold (fluid mechanics)ChipCoefficient of performanceComputer coolingFlux (metallurgy)Heat transferJet (fluid)Mechanical engineeringThermal management of electronic devices and systemsAir coolingHeat transfer coefficientHeat spreaderCoolantElectronic componentForced convectionSiliconCurrent (fluid)Micro heat exchangerHeat exchangerHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies