Effect of deposition potential on electrodeposition of Sn-Ag-Cu ternary alloy solderable coating in deep eutectic solvent
Jiacheng Huang, Wenchang Wang, Qian Xiang, Shuiping Qin, Pengju Wang, Naotoshi Mitsuzaki, Zhidong Chen
Topics & Concepts
AlloyEutectic systemDifferential scanning calorimetryNucleationChemistryDeposition (geology)Scanning electron microscopeEnergy-dispersive X-ray spectroscopyMelting pointPhase (matter)CoatingMetallurgyChemical engineeringAnalytical Chemistry (journal)Materials scienceComposite materialThermodynamicsChromatographySedimentBiologyOrganic chemistryPhysicsEngineeringPaleontologyElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesIonic liquids properties and applications