Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates
Shanjun Ding, Zhidan Fang, Zhongyao Yu, Qidong Wang
Topics & Concepts
Materials scienceMicroelectronicsCopperEpoxyDielectricPlating (geology)Copper platingCuring (chemistry)AdhesionPolymerComposite materialFabricationNanotechnologyMetallurgyOptoelectronicsElectroplatingLayer (electronics)MedicinePathologyGeologyGeophysicsAlternative medicineElectronic Packaging and Soldering TechnologiesSynthesis and properties of polymersCopper Interconnects and Reliability