Interlayer design for strong adhesion in the double-layer flexible copper clad laminate via HiPIMS deposition
Xinyu Wang, Pengli Jin, Dezhi Xiao, Yan Lu, Xiubo Tian, Xiubo Tian
Topics & Concepts
CopperAdhesionLayer (electronics)Materials scienceHigh-power impulse magnetron sputteringDeposition (geology)Composite materialMetallurgyNanotechnologyChemical engineeringSputter depositionThin filmSputteringEngineeringBiologyPaleontologySediment3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesMetal and Thin Film Mechanics