Nucleation control of high crystal quality heteroepitaxial Sc0.4Al0.6N grown by molecular beam epitaxy
Matthew T. Hardy, Andrew C. Lang, Eric N. Jin, Neeraj Nepal, Brian P. Downey, Vikrant J. Gokhale, D. S. Katzer, Virginia D. Wheeler
Abstract
High ScN fraction ScxAl1−xN has promise in important application areas including wide bandwidth RF resonators and filters, and ferroelectric devices such as non-volatile memory, but demands high crystal quality. In this work, the role of the nucleation layer (NL), ScxAl1−xN growth temperature, and strain management to preserve the wurtzite crystal structure are investigated to maximize both acoustoelectric and ferroelectric material properties for high ScN fraction ScxAl1−xN grown on SiC substrates. A 5 nm AlN nucleation layer reduces the x-ray diffraction 0002 reflection full width at half maximum (FWHM) for a Sc0.32Al0.68N film by almost a factor of 2, and reducing the growth temperature to 430 °C enables a Sc0.40Al0.60N film with a FWHM of 4100 arcsec (1.1°) while being only 150 nm thick. Grading the initial ScxAl1−xN layer from x = 0.32 to 0.40 suppresses the formation of rock-salt grain nucleation at the Sc0.40Al0.60N lower interface and reduces the anomalously oriented grain density by an order of magnitude. Increasing the total ScxAl1−xN growth thickness to 500 nm produces an average x = 0.39 ScxAl1−xN layer with a FWHM of 3190 arcsec (0.89°) and an anomalously oriented grain areal fill factor of 1.0%. These methods enable the lowest heteroepitaxial ScxAl1−xN FWHM reported for x ∼ 0.4, with layer thicknesses and defect densities appropriate for high frequency (>10 GHz) filter applications.