Experimental investigation on crack evolution and separation strength in 4H-SiC slicing by sub-nanosecond laser
Heng Wang, Qiang Cao, Tianhao Wu, Zhenzhong Wang, Yuting Hou, Sheng Peng, Du Wang, Sheng Peng, Du Wang
Topics & Concepts
SlicingNanosecondMaterials scienceLaserSeparation (statistics)Composite materialOpticsMechanical engineeringComputer sciencePhysicsEngineeringMachine learningAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisDiamond and Carbon-based Materials Research