Litcius/Paper detail

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

Yong Sheng Zou, Chong Leong Gan, Min-Hua Chung, Hem Takiar

2021Journal of Materials Science Materials in Electronics42 citationsDOI

Topics & Concepts

Materials scienceSolderingInterconnectionReliability (semiconductor)Temperature cyclingAutomotive industryDrop testIntegrated circuit packagingWire bondingMechanical engineeringComposite materialComputer scienceOptoelectronicsIntegrated circuitThermalStructural engineeringTelecommunicationsQuantum mechanicsChipPhysicsPower (physics)EngineeringMeteorologyAerospace engineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability
A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials | Litcius