Hybrid integration of ensemble nitrogen-vacancy centers in single-crystal diamond based on pick-flip-and-place transfer printing
Ryota Katsumi, Kosuke Takada, Shun Naruse, K. Kawai, Daichi Sato, Takeshi Hizawa, Takashi Yatsui
Abstract
Incorporating color centers in diamond with mature integrated photonics using hybrid integration techniques such as transfer printing provides a promising route toward scalable quantum applications. However, single-crystal diamond nanostructures fabricated using current etching technologies have triangular bottoms that are unsuitable for conventional pick-and-place integration. Herein, we present an alternative approach for deterministically integrating diamond nanostructures on chip. We demonstrate the hybrid integration of a diamond triangular nanobeam containing a nitrogen-vacancy ensemble on an SiO2 chip by picking it up using a weak adhesive film, flipping it, and transferring it to a stronger one. This “pick-flip-and-place” approach provides a flat diamond-chip interface, enabling the high-yield hybrid integration regardless of the shape of diamond nanostructures. Additionally, diamond nanofabrication is facilitated by transfer-printing hard masks for diamond etching. We also show that the integrated diamond nanobeam functions as a nanoscale quantum sensor. Our proposed approach paves the way toward scalable hybrid-diamond quantum photonics.