Interfacial diffusion and Kirkendall voids evolution in the Copper-Zinc alloy binary interface revealed by in situ transmission electron microscopy
Lilin Xie, Hui Lu, Yilin Jiao, Shihang Qiao, Yisheng Zheng, An‐Ping Li, Yanhui Chen, Xiaodong Han
Topics & Concepts
Kirkendall effectIntermetallicMaterials scienceDiffusionAlloyTransmission electron microscopyCopperVoid (composites)MicrostructureDiffusion layerMetallurgyChemical physicsCrystallographyThermodynamicsLayer (electronics)ChemistryComposite materialNanotechnologyPhysicsAluminum Alloys Composites PropertiesAluminum Alloy Microstructure PropertiesMicrostructure and mechanical properties