Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints
Limeng Yin, Zhongwen Zhang, Zilong Su, Hehe Zhang, Cunguo Zuo, Zongxiang Yao, Gang Wang, Long Zhang, Yupeng Zhang
Topics & Concepts
Materials scienceIntermetallicWettingSolderingMicrostructureUltimate tensile strengthBrittlenessComposite materialComposite numberPhase (matter)Joint (building)Brittle fractureMetallurgyFracture (geology)AlloyEngineeringChemistryArchitectural engineeringOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties