Application of an optimized alkaline cleaning solution for inhibitor removal during the post-CMP process: Performance evaluation and mechanism analysis
Wei Li, Baimei Tan, Shihao Zhang, Baohong Gao, Tengda Ma, Lei Guo, Haoyu Du, Fangyuan Wang, Xiaolong Wang
Topics & Concepts
CopperChemical-mechanical planarizationBenzotriazoleX-ray photoelectron spectroscopyPolyvinylpyrrolidoneChemistryChemical engineeringPolishingMaterials scienceInorganic chemistryMetallurgyOrganic chemistryEngineeringAdvanced Surface Polishing TechniquesSemiconductor materials and devicesCopper Interconnects and Reliability