Numerical and experimental study on laser soldering process of SnAgCu lead-free solder
Zifan Yang, Lijing Li, Wen Chen, Xudong Jiang, Yueli Liu
Topics & Concepts
SolderingMaterials sciencePrinted circuit boardFinite element methodLaserLaser power scalingStress (linguistics)Coupling (piping)Composite materialMetallurgyStructural engineeringOpticsElectrical engineeringEngineeringLinguisticsPhilosophyPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdditive Manufacturing Materials and Processes