Highly reliable micro-scale Cu sintered joint by oxidation-reduction bonding process under thermal cycling
Min‐Su Kim, Dongjin Kim, Myong‐Hoon Roh, Hiroshi Nishikawa
Topics & Concepts
Temperature cyclingMaterials scienceJoint (building)Orb (optics)Shear strength (soil)Composite materialReliability (semiconductor)Delamination (geology)Degradation (telecommunications)ThermalShear (geology)Layer (electronics)Die (integrated circuit)MetallurgyStructural engineeringPower (physics)Electronic engineeringNanotechnologyComputer scienceSoil waterArtificial intelligenceTectonicsImage (mathematics)MeteorologyPaleontologyQuantum mechanicsEnvironmental scienceSoil sciencePhysicsBiologySubductionEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis