Review on Research and Development of Abrasive Scratching of Hard Brittle Materials and Its Underlying Mechanisms
Huina Qian, Mengkai Chen, Zijian Qi, Qi Teng, Huan Qi, Li Zhang, Xiaohang Shan
Abstract
Hard brittle materials such as ceramics and crystals are commonly utilized in various industries, including information technology, mechanical engineering, and semiconductors. These materials, known for their high brittleness and hardness but low fracture toughness, pose challenges in efficient and high-quality machining. Current abrasive machining techniques involve rough grinding, fine grinding, and polishing processes, with the latter being the most time-consuming and accounting for over half of the total machining time. Improving processing parameters in rough and fine grinding can increase machining efficiency, reduce surface and subsurface damage, and improve workpiece quality, ultimately reducing the polishing time. This paper explores the abrasive scratching of hard brittle materials, examining the nucleation and propagation of cracks causing surface and subsurface damage, and the underlying mechanisms. The research provides suggestions for enhancing abrasive machining efficiency and ensuring the surface quality of hard brittle materials.