Litcius/Paper detail

Thermal management of Electronics: Numerical investigation of triangular finned heat sink

Doddamani Hithaish, V. Saravanan, C.K. Umesh, K.N. Seetharamu

2022Thermal Science and Engineering Progress26 citationsDOI

Topics & Concepts

Heat sinkMechanicsHeat transferLaminar flowFinPressure dropReynolds numberMaterials scienceCoolantThermal resistanceThermodynamicsPhysicsComposite materialTurbulenceHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies