Analysis of the influence and mechanism of the pollution condensation environment on the electrochemical migration behaviour of printed circuit board with immersion silver
Zixue Jiang, Xuan Liu, Jialiang Song, Yao Tan, Hao Zhang, Junsheng Wu, Chaofang Dong, Kui Xiao
Topics & Concepts
Immersion (mathematics)CorrosionPrinted circuit boardElectrochemistryCondensationMechanism (biology)Materials sciencePollutionMetallurgyChemical engineeringComposite materialChemistryEngineeringMeteorologyElectrical engineeringPhysicsElectrodePhysical chemistryQuantum mechanicsEcologyPure mathematicsBiologyMathematicsRecycling and Waste Management TechniquesCorrosion Behavior and InhibitionAdditive Manufacturing and 3D Printing Technologies