Influence of post-bonding heating process on the long-term reliability of Cu/Al contact
Motoki Eto, Noritoshi Araki, Takashi Yamada, Masaaki Sugiyama, Shinji Fujimoto
Topics & Concepts
Wire bondingReliability (semiconductor)Materials scienceBondAutomotive industryCorrosionCopperCopper wireProcess (computing)MetallurgyProduct (mathematics)Mechanical engineeringForensic engineeringComposite materialEngineeringElectrical engineeringComputer scienceChipBusinessPhysicsGeometryOperating systemAerospace engineeringFinanceQuantum mechanicsPower (physics)MathematicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis