Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng
Abstract
Abstract In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided.
Topics & Concepts
Flip chipSolderingJoint (building)FabricationMaterials scienceSubstrate (aquarium)Reliability (semiconductor)Electronic engineeringDrop (telecommunication)Integrated circuit packagingPackage on packageMechanical engineeringComposite materialIntegrated circuitOptoelectronicsEngineeringStructural engineeringGeologyOceanographyPhysicsLayer (electronics)AdhesiveMedicineQuantum mechanicsPathologyWafer dicingPower (physics)Alternative medicine3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering Technologies