Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films

Shih-Yang Chang, Yi‐Cheng Chu, K. N. Tu, Chih Chen

2021Materials Science and Engineering A52 citationsDOI

Topics & Concepts

Materials scienceCopperSolderingAnnealing (glass)Grain growthDirect bondingAnisotropyWafer bondingGrain sizeBonding strengthMetallurgyComposite materialCrystallographySiliconChemistryPhysicsQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability

Effect of anisotropic grain growth on improving the bonding strength of &lt;111&gt;-oriented nanotwinned copper films

Topics & Concepts

Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films