Room temperature bonding of aluminum nitride ceramic and semiconductor substrate
Takashi Matsumae, Yuichi Kurashima, Eiji Higurashi, Kazunori Nishizono, Tsutomu Amano, Hideki Takagi
Topics & Concepts
Materials scienceBonding strengthSubstrate (aquarium)CeramicAluminiumAnodic bondingLayer (electronics)NitrideSputteringComposite materialSemiconductorDirect bondingThermocompression bondingThin filmMetallurgyOptoelectronicsNanotechnologySiliconGeologyOceanography3D IC and TSV technologiesAdvanced ceramic materials synthesisSemiconductor materials and devices