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Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys

Jianglei Fan, Hengtao Zhai, Zhanyun Liu, Xiao Wang, Ying Li, Hongxia Gao, Jianxiu Liu

2020Journal of Materials Engineering and Performance16 citationsDOI

Topics & Concepts

Materials scienceIntermetallicSolderingLiquidusMicrostructureUltimate tensile strengthMetallurgySolidusAlloyMass fractionVolume fractionPhase (matter)Composite materialChemistryOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
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