Dishing-free chemical mechanical planarization for copper films

Sang-Su Yun, Young-Hye Son, Gi-Ppeum Jeong, Je-hwan Lee, Jong-han Jeong, Jae-Young Bae, Sung In Kim, Jin-Hyung Park, Jin-Hyung Park, Jea-Gun Park, Jea-Gun Park

2021Colloids and Surfaces A Physicochemical and Engineering Aspects20 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationMaterials scienceFerrousCatalysisEtching (microfabrication)PolishingChemical engineeringSlurryIsotropic etchingAbrasiveWaferCopperMetallurgyChemistryNanotechnologyComposite materialLayer (electronics)Organic chemistryEngineeringAdvanced Surface Polishing TechniquesCopper Interconnects and ReliabilityDiamond and Carbon-based Materials Research