Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm)

Liang Zhang, Zhi‐Quan Liu

2020Journal of Materials Science Materials in Electronics94 citationsDOI

Topics & Concepts

IntermetallicSolderingDiffusionMaterials sciencePhase (matter)MetallurgyChemistryThermodynamicsAlloyOrganic chemistryPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties