Revealing the adhesion strength and electronic properties of Ti3SiC2/Cu interface in Ti3SiC2 reinforced Cu-based composite by a first-principles study
Huihui Xiong, Caifang Cao, Guangjun Chen, Baixiong Liu
Topics & Concepts
Materials scienceAdhesionCovalent bondSurface energyComposite numberComposite materialBonding strengthMetalChemical bondElectronic structureMetallurgyComputational chemistryQuantum mechanicsPhysicsOrganic chemistryChemistryMXene and MAX Phase MaterialsAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesis