Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates
Chukwudi Okoro, Shrisudersan Jayaraman, Scott Pollard
Topics & Concepts
Materials scienceComposite materialAnnealing (glass)Thermal expansionCreepStress relaxationRadial stressStress (linguistics)CopperSubstrate (aquarium)Ultimate tensile strengthDeformation (meteorology)MetallurgyGeologyLinguisticsOceanographyPhilosophy3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesElectronic Packaging and Soldering Technologies