The Obstruction Effect of Ni Layer on the Interdiffusion of Cu Substrate and Sn Solder: A Theoretical Investigation
Zhuo Mao, Weiwei Zhang, Jiesen Li, Shengjie Dong, Xiang Lin, Xiaodong Jian, Ping Wu
Topics & Concepts
IntermetallicLattice diffusion coefficientSolderingMaterials scienceDiffusionVacancy defectTinDiffusion layerDiffusion barrierAtomic diffusionNickelActivation energyLattice (music)MetallurgyEffective diffusion coefficientCrystallographyChemical physicsThermodynamicsAlloyComposite materialLayer (electronics)ChemistryPhysical chemistryMedicinePhysicsAcousticsMagnetic resonance imagingRadiologyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloys Composites Properties