High-performance boron nitride epoxy composites via dendritic amino surface modification for advanced packaging applications
Zihao Lin, Alexandar King, Ju Won Lim, Kaushik Godbole, Kyoung‐sik Moon, Wen-Hsi Lee, Ching‐Ping Wong
Topics & Concepts
Materials scienceEpoxyBoron nitrideComposite materialSurface modificationBoronMechanical engineeringOrganic chemistryEngineeringChemistryBoron and Carbon Nanomaterials ResearchThermal properties of materialsGraphene research and applications