Microchannel cooling for the LHCb VELO Upgrade I
O. De Aguiar Francisco, W. Byczynski, Kazu Akiba, C. Bertella, A. Bitadze, Matthew Brock, B. Bulat, Guillaume Button, J. Buytaert, S. De Capua, Riccardo Callegari, Christine Castellana, A. Catinaccio, Catherine Charrier, Colette Charvet, V. Coco, P. Collins, J. Degrange, R. Dumps, D. Alvarez Feito, Frank Fournel, J. Freestone, Mariusz Jędrychowski, V. Franco Lima, A. Gallas Torreira, W. Hulsbergen, D. Hynds, G. Arnau Izquierdo, P. Jałocha, Eddy Jans, M. John, N. Jurik, T. Latham, A. Leflat, E. Lemos Cid, R. Lindner, Alessandro Mapelli, A. Mathad, Andy Morris, J. Noël, A. Nomerotski, R. De Oliveira, Martijn van Overbeek, Chris Parkes, P. Petagna, Alexandre Porret, D. Renaud, Erno Roeland, Giulia Romagnoli, Eric Rouchouze, Krista de Roo, Freek Sanders, Thomas Schneider, H. Schindler, Burkhard Schmidt, Andreas Schopper, Luke Scantlebury-Smead, Miranda van Stenis, P. Švihra, Benoit Teissandier, Jean-Francois Teissier, Xavier Thery, E. Thomas, B. Verlaat, Mark R.J. Williams
Abstract
The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \\cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures was completed in September 2021. This paper describes the R&D path supporting the microchannel production and assembly and the motivation for the design choices. The microchannel coolers have excellent thermal peformance, low and uniform mass, no thermal expansion mismatch with the ASICs and are radiation hard. The fluidic and thermal performance is presented.