Effects of solder thickness on interface behavior and nanoindentation characteristics in Cu/Sn/Cu microbumps
Zhiyuan Zhang, Jieshi Chen, Jianing Wang, Yuzhu Han, Zhiyuan Yu, Qinzhao Wang, Peilei Zhang, Shanglei Yang
Topics & Concepts
Materials scienceNanoindentationSolderingIntermetallicReflow solderingComposite materialLayer (electronics)Indentation hardnessMetallurgyMicrostructureAlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesInjection Molding Process and Properties