Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling
Jiaqiang Yang, Jiang-Peng Qiu, Lei Jin, Zhao‐Yun Wang, Tao Song, Yi Zhao, Xiaohui Yang, Jun Cheng, Fang‐Zu Yang, Dongping Zhan, Dongping Zhan
Topics & Concepts
Materials scienceCopperAdsorptionNuclear chemistryChemical engineeringAnalytical Chemistry (journal)Composite materialMetallurgyPhysical chemistryOrganic chemistryChemistryEngineeringElectrodeposition and Electroless CoatingsNanoporous metals and alloysCorrosion Behavior and Inhibition