Research on passive cooling of electronic chips based on PCM: A review
Weisan Hua, Liyu Zhang, Xuelai Zhang
Topics & Concepts
ChipHeat sinkComputer coolingMaterials sciencePower densityThermal conductivityThermalElectronicsThermal management of electronic devices and systemsElectronic circuitMechanical engineeringEngineering physicsPower (physics)Electrical engineeringEngineeringComposite materialThermodynamicsPhysicsPhase Change Materials ResearchThermal properties of materialsHeat Transfer and Optimization