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Depletion- and Enhancement-Mode p-Channel MISHFET Based on GaN/AlGaN Single Heterostructures on Sapphire Substrates

Carsten Beckmann, Zineng Yang, Jens Wieben, Thorsten Zweipfennig, Jasmin Ehrler, Arno Kirchbrücher, H. Kalisch, Andrei Vescan

2023IEEE Journal of the Electron Devices Society21 citationsDOIOpen Access PDF

Abstract

We report on p-channel metal-insulator-semiconductor heterostructure field-effect transistors (MISHFET) based on p-GaN/uid-GaN/Al0.29Ga0.71N single heterostructures on sapphire substrates, grown by metalorganic vapor phase epitaxy (MOVPE). The impact of p-GaN layer removal and channel layer thickness adjustment by dry-etching on the characteristics of the MISHFET are investigated. Depending on the remaining GaN thickness (tGaN), the fabricated MISHFET show either depletion-mode (d-mode) operation with a threshold voltage Vth of 3.8 V and an on-current |ID,on| of 9.5 mA/mm (tGaN = 21 nm) or enhancement-mode (e-mode) operation with Vth of -2.3 V and |ID,on| of 1.5 mA/mm (tGaN = 12 nm). Independent of the etching depth, all devices exhibit a very low off-state drain current |ID,off| 10-8 mA/mm and a steep subthreshold swing (SS) between 80 and 89 mV/dec. Similar to n-channel devices, a Vth instability caused by charge trapping at the dielectric/semiconductor interface is found, emphasizing that careful interface engineering is required for good device performance.

Topics & Concepts

Materials scienceOptoelectronicsHeterojunctionMetalorganic vapour phase epitaxyThreshold voltageEpitaxySapphireEtching (microfabrication)SemiconductorTransistorLayer (electronics)VoltageLaserNanotechnologyOpticsElectrical engineeringEngineeringPhysicsGaN-based semiconductor devices and materialsSemiconductor materials and devicesGa2O3 and related materials
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