High Thermal Conductivity 2D Materials: From Theory and Engineering to Applications
Fan Wu, He Tian, Yang Shen, Zhengqiang Zhu, Yanming Liu, Thomas Hirtz, Rui Wu, Guangyang Gou, Yancong Qiao, Yi Yang, Chaoyang Xing, Gang Zhang, Tian‐Ling Ren
Abstract
Abstract Transistors are getting close to their physical limitation, and complex chip design technologies have made the hotspot problem more serious. Graphene and hBN, as representative 2D semi‐metal and dielectric materials, possess excellent thermal conductivities. Intrinsic 2D materials, 2D film materials, and 2D composite materials have been investigated, showing great potential for next‐generation thermal‐management materials. There are products that have already been commercialized based on graphene and hBN, but many companies seem to be sitting on the fence, and the obstacles toward implementation of these materials need to be specified. Here, high thermal conductivity 2D materials from theory and engineering to applications are reviewed, aiming to provide a comprehensive summary of the current state of the art of this field in order to give an overview and future prospects in application, manufacturing, and commercialization. From the theoretical perspective, the impact factors and development path of 2D materials for thermal dissipation and the engineering aspect of structural design are presented. The prospects and challenges are also tackled, expressing an objective view about future opportunities to build 2D‐based heat‐dissipation systems.