Towards accurate temperature prediction in BEOL for reliability assessment (Invited)
Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, A. Leśniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tökei
Abstract
Back end of line (BEOL) reliability strongly depends on the absolute temperature and temperature distribution in the interconnect lines. In this work, we present a holistic approach that combines experimental characterization, such as BEOL self-heating measurements and material properties characterization, with hybrid modeling to investigate the impact of BEOL design, materials, and technology options on the self-heating of the BEOL. The thermal coupling from Front End of Line (FEOL) to BEOL is also investigated in this work.
Topics & Concepts
Back end of lineInterconnectionReliability (semiconductor)Materials scienceCharacterization (materials science)ThermalReliability engineeringWork (physics)Coupling (piping)Electronic engineeringComputer scienceOptoelectronicsMechanical engineeringNanotechnologyComposite materialEngineeringDielectricPhysicsQuantum mechanicsMeteorologyPower (physics)Computer networkSemiconductor materials and devicesCopper Interconnects and ReliabilityIntegrated Circuits and Semiconductor Failure Analysis