Study of ultrasonic vibration-assisted grinding SiCp/Al composites: Surface formation mechanism considering interface failure and process method towards low surface defects
Wei Zheng, Xingqi Tang, Da Qu, Ling Liu
Topics & Concepts
Materials scienceComposite materialGrindingUltrasonic sensorSurface (topology)VibrationInterface (matter)Process (computing)WettingAcousticsMathematicsSessile drop techniqueOperating systemComputer scienceGeometryPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques