Research on damage and crack evolution mechanism of backfill under the coupling effect of layer-inclined angle-pore triple defect structure
Shengyou Zhang, Wei Sun, Zhengmeng Hou, Aixiang Wu, Zhaoyu Li, S. Wang, Minggui Jiang, Zeng Liu
Topics & Concepts
Materials scienceMechanism (biology)Layer (electronics)Coupling (piping)Composite materialFailure mechanismGeotechnical engineeringStructural engineeringGeologyEngineeringPhysicsQuantum mechanicsTailings Management and PropertiesRock Mechanics and ModelingNumerical methods in engineering