Low thermal expansion coefficient and high thermal conductivity epoxy/Al2O3/T-ZnOw composites with dual-scale interpenetrating network structure
Binyong Wu, Ruoyu Chen, Renli Fu, Simeon Agathopoulos, Xinqing Su, Houbao Liu
Topics & Concepts
Materials scienceComposite materialEpoxyThermal expansionFlexural strengthThermal conductivityCeramicComposite numberWhiskersInterpenetrating polymer networkDielectricPolymerOptoelectronicsThermal properties of materialsThermal Expansion and Ionic ConductivityDielectric materials and actuators