Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition
Myung Hyun Lee, Yoonjae Lee, Jung Ah Kim, Youngkeun Jeon, Myung Jun Kim, Young Gyu Kim, Jae Jeong Kim
Topics & Concepts
FabricationMaterials scienceCurrent densityNanotechnologyChemical engineeringEngineeringQuantum mechanicsPhysicsAlternative medicineMedicinePathologyElectrodeposition and Electroless CoatingsNanoporous metals and alloysCopper Interconnects and Reliability