Interlayer design for partial transient liquid phase bonding of titanium and copper
Yongqiang Deng, Wanliang Zhong, Huibin Xu
Topics & Concepts
Materials scienceBrazingIntermetallicTitaniumCopperMetallurgyHomogenization (climate)Liquid phasePhase (matter)Bonding strengthJoint (building)Composite materialAlloyThermodynamicsChemistryEcologyBiologyOrganic chemistryArchitectural engineeringPhysicsEngineeringBiodiversityAdvanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties