Litcius/Paper detail

Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

Hossein Madanipour, Yiram Kim, Choong-Un Kim, Dibyajat Mishra, Patrick Thompson

2020Journal of Alloys and Compounds21 citationsDOI

Topics & Concepts

SolderingElectromigrationIntermetallicMicrostructureMaterials scienceJoint (building)CathodeMetallurgyAlloyComposite materialAnodeElectrodeChemistryEngineeringArchitectural engineeringPhysical chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability
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