In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

Jinhong Liu, Jianhao Xu, Kyung‐Wook Paik, Peng He, Shuye Zhang

2023Journal of Material Science and Technology138 citationsDOI

Topics & Concepts

SolderingMaterials scienceIsothermal processJoint (building)MetallurgyMicroelectronicsInterconnectionComposite materialOptoelectronicsStructural engineeringThermodynamicsEngineeringComputer sciencePhysicsComputer networkElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis