Litcius/Paper detail

Interweaved filler network in epoxy resin with reduced interface thermal resistance via in-situ high-temperature “welding” for significantly improved thermal conductivity

Yani Lu, Xinwei Xu, Li Li, Jiufeng Dong, Renchao Hu, Wenjin Chen, Weishu Liu, Hong Wang

2024Chemical Engineering Journal11 citationsDOI

Topics & Concepts

EpoxyMaterials scienceThermal conductivityComposite materialIn situWeldingFiller (materials)Thermal resistanceInterface (matter)ThermalHeat resistanceChemistryPhysicsCapillary numberOrganic chemistryMeteorologyCapillary actionThermal properties of materialsComposite Material MechanicsMechanical Behavior of Composites
Interweaved filler network in epoxy resin with reduced interface thermal resistance via in-situ high-temperature “welding” for significantly improved thermal conductivity | Litcius