Enhanced thermal conduction of hybrid filler/polydimethylsiloxane composites via a continuous spatial confining process
Hongbo Fu, Yao Huang, Ying Liu, Fei Li, Zipeng Gai, Yonghua Jiang, Xiaolong Gao, Jian Zhuang, Jingyao Sun, Hong Xu, Daming Wu
Topics & Concepts
Materials sciencePolydimethylsiloxaneComposite materialFiller (materials)Thermal conductionThermalProcess (computing)Operating systemPhysicsComputer scienceMeteorologyThermal properties of materialsHeat Transfer and OptimizationAdvanced Thermoelectric Materials and Devices