Litcius/Paper detail

Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

Gautier Girard, M. Martiny, S. Mercier

2020Microelectronics Reliability26 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceCopperPrinted circuit boardHardening (computing)Structural engineeringBendingComposite materialMetallurgyEngineeringElectrical engineeringLayer (electronics)Electronic Packaging and Soldering TechnologiesMechanical Behavior of CompositesAluminum Alloys Composites Properties