Grain boundary sliding model for assessing creep-fatigue life of Sn37Pb eutectic solder
Masao Sakane, Takeshi Shiratsuchi, Yutaka Tsukada
Topics & Concepts
CreepEutectic systemMaterials scienceGrain Boundary SlidingSolderingDuctility (Earth science)Grain boundaryMetallurgyStructural engineeringEngineeringAlloyMicrostructureElectronic Packaging and Soldering TechnologiesHigh Temperature Alloys and CreepAluminum Alloy Microstructure Properties