Performance analysis of Gallium-based liquid metal as thermal interface material for chip heat dissipation
Baihong Liu, Wenfeng Gao, Liangfei Duan, Qiong Li, Shuai Gong, Rujian Li, Jie Zhang
Topics & Concepts
Materials scienceGalliumThermal management of electronic devices and systemsDissipationLiquid metalInterface (matter)Thermal greaseThermalChipNuclear engineeringMechanicsThermodynamicsComposite materialMechanical engineeringThermal conductivityComputer scienceMetallurgyPhysicsEngineeringTelecommunicationsCapillary actionCapillary numberThermal properties of materialsElectronic Packaging and Soldering TechnologiesHeat Transfer and Optimization