A review in thermal management for advanced chip packaging from chip to heat sink
Min Soo Kim, Jaehyun Kim, Woosung Park, Joon Sang Kang
Topics & Concepts
Heat sinkThermal management of electronic devices and systemsChipComputer scienceEngineeringMechanical engineeringElectrical engineeringThermal properties of materialsElectronic Packaging and Soldering Technologies3D IC and TSV technologies